||T = Tin Plated over Nickel Barrier Termination*
TN = Tin Plated over Non-Magnetic Barrier Termination*
W = Tin/Lead, Solder Plated over Nickel Barrier Termination
CN = Non-Magnetic Palladium Silver Terminations
||Terminations for chips withstand a pull of 10 lbs. min., 15 lbs. typical, for 5 seconds in direction perpendicular to the termination surface of the capacitor. Test per MIL-STD-202, method 211.