||T = Tin Plated over Nickel Barrier Termination*
TN = Tin Plated over Non-Magnetic Barrier Termination*
W = Tin/Lead, Solder Plated over Nickel Barrier Termination
WN = Tin/Lead, Solder Plated over Non-Magnetic Barrier Termination
P = Heavy Tin/Lead Coated, over Nickel Barrier Termination
PN = Heavy Tin/Lead Coated, over Non-Magnetic Barrier Termination
CA = Gold Plated over Nickel Barrier Termination*
Leaded Styles: See note below.
||Terminations for chips and pellets withstand a pull of 5 lbs. min., 15 lbs. typical, for 5 seconds in direction perpendicular to the termination surface of the capacitor. Test per MIL-STD-202, method 211.
NOTE: Leaded styles are available: Microstrip (MS), Axial Ribbon (AR), Radial Ribbon (RR), Radial Wire (RW), Axial Wire (AW), Narrow Microstrip (NM), Narrow Axial Ribbon (NA) and Vertical Narrow Microstrip (H), Non-Mag Microstrip (MN), Non-Mag Axial Ribbon (AN), Non-Mag Radial Ribbon (FN), Non-Mag Radial Wire (RN), Non-Mag Axial Wire (BN), Non-Mag Narrow Microstrip (DN), Non-Mag Narrow Axial Ribbon (GN) and Non-Mag Vertical Narrow Microstrip (HN). All leads are high purity silver attached with high temperature solder and are RoHS compliant.
* RoHS Compliant