Technical Notes

  ATC Q-Bridge Thermal Conductor Application Note
  Selecting RF Chip Capacitors for Wireless Applications
  Suggested Mounting Pad Dimensions for ATC Multilayer Chip Capacitors
  ESR Losses in Ceramic Capacitors
  ATC Resistors and Terminations Engineering Guidelines: Design, Measurement and Performance
  RF Ceramic Chip Capacitors in High RF Power Applications
  Capacitors in Broadband Applications
(reproduced with permission of Applied Microwave and Wireless, May, 2001)
  Capacitor Tolerance Selection for Coupling, DC Blocking, and Bypass Applications
(reproduced with permission of MPD, Sept., 2001)
  RF Power Amplifiers Operate Cooler with Improved Reliability Using ATC's EIA 600 Series Ultra-Low ESR Ceramic Capacitors
(Reproduced with permission of MPD, May, 2003)

  Considerations for Optimal Capacitive Coupling
(Reproduced with permission of Microwave Product Digest, March, 2004)
  Capacitor Pi Network for Impedance Matching using Modelithics Models
  Recommended Attachment Techniques for ATC Multilayer Chip Capacitors - Bulletin No. 201
  S-Parameter Test Method
  Surface-Mount NPO Capacitors
  Recommended Soldering Techniques for ATC 500 Capacitors
  Laser Marking of ATC Capacitors
  Thermal Resistance, Power Dissipation and Current Rating for Ceramic and Porcelain Multilayer Capacitors
  Vertical Orientation of ATC Chip Capacitors On Striplines
  Recommended Handling and Attachment Techniques for Microcap Capacitors Bulletin No. 202
  ATC MLC Surface Mount Tape and Reel Packaging Specifications
  AS 9100C (FL)
  ISO 14001: 2004 (NY)
  ISO 9001: 2000 Certificate (FL)
  ATC Quality Policy
  RoHS Compliancy Notice

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